ASE Technology: ASE unit launches automated 310mm panel-level packaging to accelerate AI innovation

[출처/시간] Briefing.com - 9:06 AM ET, 05/26/2026

Co's Advanced Semiconductor Engineering unit announces the development of an industry-first automated 310mm 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to enter production in 1H27. Co says this announcement further accentuates ASE's commitment to enabling the semiconductor industry's transition into the era of heterogeneous integration, where performance is increasingly defined by high-bandwidth, low-latency interconnects across chiplets, ASICs, and high-bandwidth memory (HBM).